POWER LINK CAPACITORS

PowerLink

Eigenschaften:

- Compact design for PCB assembly
- High energy of up to 18Ws
- Vibration-proof 4 pin connections
- Self-sealing polypropylene dielectric
- Custom specifications on request
PowerLink Filmkondensator
Self-sealing polypropylene film capacitor with high energy of up to 18 Ws for PCB assembly, contacting via 4 PCB pins, capacities from 6µF- 65µF, voltages from 700Vdc - 1500Vdc, temperature range of 40°C – 85°C, other specifications on request.Main areas of use are renewable energies, aeronautics, defence technology and flash applications.

PowerLink with snap-in contacts

Eigenschaften:

- Economical PCB assembly with no soldering
- Vibration-proof up to 50 g
- Low contact resistance
- Extremely gentle snap-in process
PowerLink Filmkondensator mit Einpresskontakten
The same technical properties as the standard PowerLink, but with EloPin® snap-in contacts.Snap-in technology is a solderless, electromechanical connection method. A permanent gas-tight connection is established between the insertion area of the pins and the metallised hole wall.The EloPin fulfils the requirements of DIN EN (IEC) 60352-5 as well as the increased requirements for automotive applications according to DIN (ISO) 60 352-5.The use of snap-in contacts gives the user a considerable cost advantage with higher reliability than with comparable soldered connections. Please contact our sales team for more information.

Double PowerLink

Eigenschaften:

- 2 parallel windings reduce PCB size by half
- High energy of up to 28Ws
- Vibration-proof 4 pin connections
- Self-sealing polypropylene dielectric
- Custom specifications on request
Double PowerLink Filmkondensator
Self-sealing polypropylene film capacitor with very high energy of up to 28 Ws for PCB assembly, contacting via 4 PCB pins, capacities from 11µF- 85µF, voltages from 700Vdc - 1500Vdc, temperature range of 40°C – 85°C, other specifications on request.
Main areas of use are renewable energies, aeronautics, defence technology and flash applications.

Double PowerLink with snap-in contacts

Eigenschaften:

- Economical PCB assembly with no soldering
- Vibration-proof up to 50 g
- Low contact resistance
- Extremely gentle snap-in process
Double PowerLink Filmkondensator mit Einpresskontakten
The same technical properties as the standard Double PowerLink, but with EloPin® snap-in contacts.
Snap-in technology is a solderless, electromechanical connection method. A permanent gas-tight connection is established between the insertion area of the pins and the metallised hole wall.
The EloPin fulfils the requirements of DIN EN (IEC) 60352-5 as well as the increased requirements for automotive applications according to DIN (ISO) 60 352-5.
The use of snap-in contacts gives the user a considerable cost advantage with higher reliability than comparable soldered connections.
Please contact our sales team for more information.