PowerLink
Features:
- Compact design for PCB assembly- High energy of up to 18Ws
- Vibration-proof 4 pin connections
- Self-sealing polypropylene dielectric
- Custom specifications on request
Self-sealing polypropylene film capacitor with high energy of up to 18 Ws for PCB assembly, contacting via 4 PCB pins, capacities from 6µF- 65µF, voltages from 700Vdc - 1500Vdc, temperature range of 40°C – 85°C, other specifications on request.Main areas of use are renewable energies, aeronautics, defence technology and flash applications.
PowerLink with snap-in contacts
Features:
- Economical PCB assembly with no soldering- Vibration-proof up to 50 g
- Low contact resistance
- Extremely gentle snap-in process
The same technical properties as the standard PowerLink, but with EloPin® snap-in contacts.Snap-in technology is a solderless, electromechanical connection method. A permanent gas-tight connection is established between the insertion area of the pins and the metallised hole wall.The EloPin fulfils the requirements of DIN EN (IEC) 60352-5 as well as the increased requirements for automotive applications according to DIN (ISO) 60 352-5.The use of snap-in contacts gives the user a considerable cost advantage with higher reliability than with comparable soldered connections. Please contact our sales team for more information.
Double PowerLink
Features:
- 2 parallel windings reduce PCB size by half- High energy of up to 28Ws
- Vibration-proof 4 pin connections
- Self-sealing polypropylene dielectric
- Custom specifications on request
Self-sealing polypropylene film capacitor with very high energy of up to 28 Ws for PCB assembly, contacting via 4 PCB pins, capacities from 11µF- 85µF, voltages from 700Vdc - 1500Vdc, temperature range of 40°C – 85°C, other specifications on request.
Main areas of use are renewable energies, aeronautics, defence technology and flash applications.
Main areas of use are renewable energies, aeronautics, defence technology and flash applications.
Double PowerLink with snap-in contacts
Features:
- Economical PCB assembly with no soldering- Vibration-proof up to 50 g
- Low contact resistance
- Extremely gentle snap-in process
The same technical properties as the standard Double PowerLink, but with EloPin® snap-in contacts.
Snap-in technology is a solderless, electromechanical connection method. A permanent gas-tight connection is established between the insertion area of the pins and the metallised hole wall.
The EloPin fulfils the requirements of DIN EN (IEC) 60352-5 as well as the increased requirements for automotive applications according to DIN (ISO) 60 352-5.
The use of snap-in contacts gives the user a considerable cost advantage with higher reliability than comparable soldered connections.
Please contact our sales team for more information.
Snap-in technology is a solderless, electromechanical connection method. A permanent gas-tight connection is established between the insertion area of the pins and the metallised hole wall.
The EloPin fulfils the requirements of DIN EN (IEC) 60352-5 as well as the increased requirements for automotive applications according to DIN (ISO) 60 352-5.
The use of snap-in contacts gives the user a considerable cost advantage with higher reliability than comparable soldered connections.
Please contact our sales team for more information.